Mold Flow Analysis of Panel Mount Connector: PPO vs. PBT for Performance Optimization
Plastics, initially viewed as alternatives to metals and wood, have become indispensable due to their versatility and customizable properties. However, optimizing the injection molding process for high-performance applications remains a significant challenge, particularly in managing defects such as warping, shrinkage, and deformation. These issues arise from the complex interplay of material properties and process parameters, necessitating advanced modeling and simulation to address them effectively. This study examines the mold flow behavior of a high-performance circular panel mount connector, comparing polyphenylene oxide (PPO) and polybutylene terephthalate (PBT). By simulating both materials on the same model, we analyze their impact on fill patterns, shrinkage, warping, and deformation. The quantitative results indicate that PPO exhibits a lower maximum volumetric shrinkage (12%) compared to PBT (15%) in Moldex3D simulations, highlighting its superior dimensional stability and reduced risk of warpage. The proposed solution involves leveraging accurate Computer-Aided Engineering (CAE) simulations to identify optimal material and process configurations. The main contributions of this work are threefold: first, a comparative analysis of PPO and PBT to determine their suitability for high-precision applications; second, the identification of key parameters influencing defect formation and strategies for their mitigation; and third, the demonstration of the critical role of simulation in enhancing material selection and process efficiency. The findings offer valuable insights into optimizing injection molding for industrial applications, underscoring the importance of simulation as a vital tool in advancing the quality and performance of polymer-based components.
Authors
- Yassine Zahraoui (ORCID: https://orcid.org/0000-0003-2308-9784)
- Souad Tayane
- Jaafar Gaber (ORCID: https://orcid.org/0000-0003-4356-6760)
- Mohamed Ennaji (ORCID: https://orcid.org/0000-0001-5353-6851)
- Zineb Achor (ORCID: https://orcid.org/0009-0005-4934-7448)
Institutions
- Centre National de la Recherche Scientifique (FR)
- Franche-Comté Électronique Mécanique Thermique et Optique - Sciences et Technologies (FR)
- Université de technologie de belfort-montbéliard (FR)
- Université Hassan II Mohammedia (MA)
- Hassania School of Public Works (MA)
- University of Hassan II Casablanca (MA)
Publication Details
- Published
- 2025-05-15
- DOI
- https://doi.org/10.1109/iraset64571.2025.11008150
- Citations
- 1
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.73