W-Band 0.5-W Waveguide Module Utilizing Spatial Power Combining of Linear Amplifier Array

This letter introduces a W-band high-power module that employs a spatial power combining technique for a linear array of discrete amplifier chips. To evaluate packaging and power combining efficiencies, two separate modules are assembled: one with a single chip and another with a linear array of ten chips. The linear chip array is positioned across the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">E</i>-plane channel, that maintains uniform field distribution over significantly increased width of 28 mm. By properly implementing an absorber film to suppress spurious oscillations, the array module achieves an average gain of 9.61 dB from 93 to 101 GHz, reflecting a 1.82 dB reduction compared to the single-element module. It delivers a peak power of 27.78 dBm at 97 GHz, with an average output of 26.72 dBm—an 8.95 dB increase over the single module—demonstrating a power combining efficiency of −1.05 dB.