Signal Integrity Analysis of Biodegradable Stretchable Interconnect for Wearable Application

The advent of conformable electronic devices has led to immense development in emerging sectors, such as biosensors, flexible electronics and wearable applications. Fabrication of serpentine interconnect is of supreme importance for the feasibility of the flexible electronics system. In this work, biodegradable textile is considered as a flexible or stretchable substrate. Use of textile in electronics has emerged as a compelling solution for wearable electronics applications. Due to its robust characteristics, including multiple stretching capabilities and frictionless properties, it serves as an excellent substrate. The stretchable interconnect is another essential entity in the development of wearable devices. In current work, this is fabricated over biodegradable textile using serpentine structure and graphene (Gr) as conductive material. In addition to fabrication, the driver-interconnect-load (DIL) model of the stretchable interconnect is novely incorporated to assess its signal integrity. In the domain of reconfigurable systems, the DIL model plays a crucial role in achieving reliability of electronic system design. The interconnect design is vital to mitigate timing issues and enhance system performance. This paper explores the optimization and significance of stretchable interconnects within the DIL framework.