Synthesis and thermal characterization of γ-Glycidoxypropyltrimethoxysilane modified phenol-formaldehyde resin

This study investigates the synthesis of γ-Glycidoxypropyltrimethoxysilane (KH-560) modified phenol-formaldehyde (PF) resin and its thermal properties. The modification aimed to improve the thermal stability of the PF resin by forming covalent linkages through KH-560. The successful incorporation of KH-560 into the PF resin was confirmed by Fourier Transform Infrared Spectroscopy (FTIR) and proton Nuclear Magnetic Resonance (¹H NMR) analyses. Thermal characterization using Differential Scanning Calorimetry (DSC) revealed that the KH-560 modification led to an increase in the curing temperature and a enhanced exothermic curing reaction compared to the unmodified resin. Thermogravimetric Analysis (TGA) demonstrated an improvement in the thermal stability of the modified PF resin, with higher decomposition temperatures and slower decomposition rates compared to the unmodified resin. These findings confirm that KH-560 is an effective modifier for enhancing the thermal properties of PF resin.

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Publication Details

Journal
Journal of Military Science and Technology
Published
2025-05-26
DOI
https://doi.org/10.54939/1859-1043.j.mst.103.2025.47-54
Primary Topic
Epoxy Resin Curing Processes
Type
article
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article

Synthesis and thermal characterization of γ-Glycidoxypropyltrimethoxysilane modified phenol-formaldehyde resin

Van Sinh Nguyen, Xuan Dao, Thi Khanh Linh Tran, Nguyen Xuan Anh et al.
Journal of Military Science and Technology
Epoxy Resin Curing Processes
article

Synthesis and thermal characterization of γ-Glycidoxypropyltrimethoxysilane modified phenol-formaldehyde resin

Van Sinh Nguyen, Xuan Dao, Thi Khanh Linh Tran, Nguyen Xuan Anh, Tung Le, Thi Thu Trang Pham, Dung Tien, Nhu Hai Luong
article en

Abstract

This study investigates the synthesis of γ-Glycidoxypropyltrimethoxysilane (KH-560) modified phenol-formaldehyde (PF) resin and its thermal properties. The modification aimed to improve the thermal stability of the PF resin by forming covalent linkages through KH-560. The successful incorporation of KH-560 into the PF resin was confirmed by Fourier Transform Infrared Spectroscopy (FTIR) and proton Nuclear Magnetic Resonance (¹H NMR) analyses. Thermal characterization using Differential Scanning Calorimetry (DSC) revealed that the KH-560 modification led to an increase in the curing temperature and a enhanced exothermic curing reaction compared to the unmodified resin. Thermogravimetric Analysis (TGA) demonstrated an improvement in the thermal stability of the modified PF resin, with higher decomposition temperatures and slower decomposition rates compared to the unmodified resin. These findings confirm that KH-560 is an effective modifier for enhancing the thermal properties of PF resin.

Journal of Military Science and TechnologyVol. 103
Hanoi Open University (VN), Vietnam Military Medical University (VN), Vietnam Academy of Science and Technology (VN)
Openalex Percentile: Top 89%
Epoxy Resin Curing Processes
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