Research on penetrating liquid cooling heat dissipation design and simulation of high heat flux density computing power servers

Abstract With the continuous development of technologies such as artificial intelligence, big data, and cloud computing, the demand for high heat flux density computing power servers has witnessed explosive growth. The key technology affecting the stable and reliable operation of these computing power services is thermal design. Traditional air-cooling technology has great difficulty in dissipating heat for them. At present, the research focus of heat dissipation technology for high heat flux density computing power servers is liquid-cooling technology, mainly due to the advantages of liquid-cooling such as strong fluidity and high heat transfer coefficient. In this paper, aiming at the main challenge of thermal design for high heat flux density computing power servers, a through-type liquid-cooling heat dissipation system was constructed for 6U equipment, and a liquid-cooling chassis and coolant flow channels were designed. The design of the through-type liquid-cooling plate is the core of this design. The thermal simulation was carried out, and the results of the thermal simulation show that through-type liquid-cooling can effectively solve the heat dissipation problem of high-power-consumption modules.