Optimized Design and Analysis of Bonding Wire in Power Modules Through Electric-Thermal-Structural and Electromagnetic Simulations
In this study, the electrical, thermal, mechanical, and electromagnetic performance of power modules was evaluated using Design of Experiments (DOE) and Finite Element Analysis (FEA). ANOVA was employed to quantitatively assess the impact of wire parameter variations on performance, leading to the proposal of an optimal design strategy. This study proposes design guidelines to improve both the reliability and performance of power modules.
Authors
- Shujun J. Zhang (ORCID: https://orcid.org/0000-0001-6139-6887)
- Na-Yeon Choi (ORCID: https://orcid.org/0000-0002-0635-2678)
Institutions
- Dong-Eui University (KR)
Publication Details
- Published
- 2025-04-06
- DOI
- https://doi.org/10.1109/eurosime65125.2025.11006529
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00