Usage of Reactive Joining Methods on LTCC Substrates: Experiments and Simulation

Some applications in electronic packaging suffer from the global heat application used by the conventional joining technologies (e.g. soldering, welding, gluing). In contrast, local heat generation, which could be provided by reactive bonding methods, would not only enable additive joining for 3D build up assemblies, it would also protect temperature sensitive structures from being overheated and thus allows the application of a wider material spectrum (e.g. thermoplastics) in the assemblies. Therefore, it was studied, if reactive bonding methods could be expanded outside the established application areas of Si to Si and metal to metal bonding. One of the targeted material systems have been glass-ceramics like LTCC substrates. The paper gives an overview over the different approaches of simulational and experimental investigations, that had been undertaken to reactively bond LTCC substrate material with each other.