Thermal Effects in Surface Acoustic Wave Devices Induced by Damping

This work analyses the damping effect which appears in surface acoustic wave - based devices. Damping can have a critical role in the efficiency and fidelity of surface acoustic wave devices, as it has effect on the heating of the structures. The current paper presents an original approach on the thermal behavior of a SAW structure developed on <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{Sc}_{0.3} \text{Al}_{0.7} \mathrm{N} / \text{Si}$</tex>, when the damping is increased between 0.02 and 0.1. The mechanical distribution and thermal effect are analyzed through a multiphysics coupled finite element model for two propagation modes: Rayleigh (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$f_{R}=4.67 \text{GHz}$</tex>) and Sezawa (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{f}_{\mathrm{S}}=8 \text{GHz}$</tex>).