Structural optimization and thermal performance analysis of minichannel heat Sinks: A numerical approach

The development characteristics of modern electronic devices with high integration and high heat flow density make their heat dissipation demand and difficulty increase continuously, and the traditional heat dissipation methods are difficult to meet the heat dissipation demand of high heat flow chips. In this study, based on the rectangular channel, we propose the optimized design of the minichannel heat sink structure combining the sinusoidal waveform and the hole-shaped secondary channels, and through numerical simulation, we study the flow and heat transfer characteristics of the minichannel heat sink with wave-hole complex structure. The results show that compared with the rectangular channel, the unique structure of the wavy channel combined with the hole-shaped secondary channel can effectively disrupt the thermal boundary layer through controlled vortex shedding and the flow boundary layer to generate Dean vortices, which enhances the fluid perturbation, improves the heat transfer efficiency of the minichannel and promotes the heat transfer uniformity across the flow channel. Both the different schemes of opening holes at peaks and valleys and opening holes between peaks and valleys significantly enhance the heat transfer characteristics of heat sinks in wave-porous minichannels. In the discussed range of Re = 50∼900, the two open-hole schemes reduce the thermal resistance by 55.6 % and 55.44 %, improve the Nusselt number ratio by 251 % and 250 %, and improve the temperature uniformity of the heat source by 36.4 % and 35.45 %, respectively, which effectively reduces the risk of hot spots in the core area of the heat source. In addition, the entropy generation number of both is always below the critical value of 1. And the maximum comprehensive performance evaluation criteria of 1.92 was achieved for the peak-to-valley opening scheme.