Mechanical Parameter Identification for Soft Potting Materials Used in Frame-Based Power Modules

Frame-based power electronics where silicone gels serve as potting materials inside the module are widely used in various applications, including renewable energy systems, energy storage systems, transportation, and automotive. The softness of silicone gels makes its mechanical characterization challenging due to difficulties in producing samples, temperature-dependency, testing setup, and measuring sensitivity. Our work presents a novel method for creating a temperature-dependent viscoelastic material model for potting materials used in frame-based power modules. By combining dynamic mechanical analysis testing and finite element analysis simulations, parameters for a temperature-dependent material model have been identified. This approach overcomes the complexities of mechanical characterization of soft silicone gels and reduces the number of tests required.