Microvia Homogenised Behaviour for the Mechanical Modelling of PCB with Embedded Components

Driven by the development of e-mobility, printed circuit boards with active embedded components are seen as potential design to increase interconnect density. One way to increase the lifetime of printed circuits boards is to investigate the response of the interconnect layers of embedded components, areas that can be subject to various types of failure. Chip interconnection by numerous microvias is a highly developed industrial technique. Nowadays numerical studies are realised on the reliability of microvias on embedded components. The numerical modelling problem arises from the very large number of microvias connecting the chip surface to the rest of the printed circuit board. To overcome this problem, a homogenisation method is proposed. Once defined, the equivalent homogeneous material may replace the real microvia in a larger design. It is seen in this work that models with homogenised and real microvias provide consistent predictions for averages. Nevertheless, local stresses and strains are not accessible in homogeneous models. Thus it is necessary to combine fully discretised patterns and homogenised ones. This will enable the detection of crack initiation zones in microvia interconnect layers in the context of embedded component printed circuit board technology.