Crack Growth Modelling in Semiconductor Package Materials by Digital Image Correlation and Finite Element Methods
Flip-Chip Ball Grid Array microcontrollers facing harsh environments demand for increased robustness and reliability against crack growth in packaging materials. This paper focuses on combined experimental and simulation methods to extract acceleration and lifetime models for crack propagation in capillary underfill and epoxy molding compound materials for package reliability assessment.
Authors
- Indiresh S. Rau
- Georg M. Reuther
- Bernhard Wunderle (ORCID: https://orcid.org/0000-0001-9675-4365)
- Brinda George
Institutions
- Infineon Technologies (Germany) (DE)
- Chemnitz University of Technology (DE)
Publication Details
- Published
- 2025-04-06
- DOI
- https://doi.org/10.1109/eurosime65125.2025.11006618
- Primary Topic
- Industrial Vision Systems and Defect Detection
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Bundesministerium für Bildung und Forschung