Research on Rapid Thermal Design Tool for Chiplet

The complex structure of Chiplet packages, combined with the use of high-power chips and the high-density integration of multiple chips, presents significant challenges in thermal management. Accurately and efficiently determining the heat distribution in such systems is crucial. While traditional thermal analysis methods can achieve high precision, they are often hindered by high computational costs and long processing times. Existing tools such as HotSpot and Therminator, designed for rapid and cost-effective computation with reasonable accuracy, are primarily geared towards monolithic integrated chips and are not suitable for evaluating the thermal performance of Chiplet package structures. To address these limitations, this paper presents a novel and efficient thermal analysis method specifically tailored for Chiplet packages. This method offers a rapid, low-cost, and accurate approach for thermal analysis in the early design stages, providing quick temperature predictions that assist in optimizing the design and manufacturing of Chiplet package structures. The development of such a method is crucial for overcoming current challenges in Chiplet thermal analysis and represents a significant advancement in the field of thermal management for integrated circuits.