Physics-of-Failure based Lifetime Prediction for Power Electronics under Mission Profile Load Conditions

This study emphasizes the use of experimental and simulation methodologies to analyze the thermo-mechanical reliability of electronic components used in power electronics, particularly focusing on the Infineon 1200 V SiC halfbridge module under WLTP (Worldwide Harmonized Light Vehicles Test Procedure) driving cycle conditions. The paper highlights the discrepancies in traditional design studies which often overlook the interaction of load sequences during a component's lifetime. By employing a computational efficient approach that includes coupled simulations and validated lifetime models, the study provides a more realistic assessment of component degradation, which is crucial for ensuring the reliability of power modules in variable operational conditions. The results of the study validate the computational models against experimental data and demonstrate the potential for using these methods in future Design for Reliability studies based on mission profiles, as well as providing a basis for the development of surrogate models towards a digital twin representation.