Verification of Material Models of an Epoxy Mold Compound Used in Power Module

When dealing with data derived through simulations, the “trustworthiness” of the information derived from simulation models is a big challenge. To help overcome this hurdle, credibility plays an important role, wherein a simulation model is verified and validated, thereby instilling trustworthiness in the simulation model, and correspondingly the results obtained through it. In view of this, in this work we aim to verify material models which will be used subsequently in the FE-model of a power module. This has been achieved by investigating the response of different material model formulations of the epoxy mold compound used for encapsulation in power modules by simulating the material relaxation phenomenon. In this investigative work, we have simulated different material models, such as temperature-independent and temperature-dependent linear elastic, linear viscoelastic, and non-linear viscoelastic material models of the mold compound. The aim is to investigate the material model sensitivity on simulation results as a part of the overall model verification process.