Elastic-Plastic-Creep Model with Damage for SAC Solder Alloys

We consider an elastic, visco-plastic material model with damage for SAC solders. The inelastic deformation is a combination of rate-independent plasticity and rate-dependent creep. The plasticity model is derived for nonlinear isotropic and kinematic hardening behavior and creep is introduced in the form of a hyperbolic sine function. Material damage is included in the constitutive equations as a scalar damage parameter. The latter is considered an internal state variable and can be interpreted as a density of microcracks or microscopic voids in a material volume element. Material parameters governing the constitutive equations for creep strain rate and the damage evolution are identified based on experimental results of pristine and pre-damaged samples at a constant temperature. The plasticity parameters are estimated based on displacement-controlled cycling of pristine specimens. The numerical model is implemented in the structural mechanics finite element software ANSYS. With the implemented model a numerical simulation of a solder ball temperature cycling is performed and damage evolution is analyzed.

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Publication Details

Published
2025-04-06
DOI
https://doi.org/10.1109/eurosime65125.2025.11006603
Citations
1
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
Field-Weighted Citation Impact
0.73
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article

Elastic-Plastic-Creep Model with Damage for SAC Solder Alloys

Aleksandr Morozov, Y. Chen, Wolfgang H. Müller, T. Hauck et al.
1 citations
Electronic Packaging and Soldering Technologies
0.73
article

Elastic-Plastic-Creep Model with Damage for SAC Solder Alloys

Aleksandr Morozov, Y. Chen, Wolfgang H. Müller, T. Hauck, L. Renzi
article en
1 citations

Abstract

We consider an elastic, visco-plastic material model with damage for SAC solders. The inelastic deformation is a combination of rate-independent plasticity and rate-dependent creep. The plasticity model is derived for nonlinear isotropic and kinematic hardening behavior and creep is introduced in the form of a hyperbolic sine function. Material damage is included in the constitutive equations as a scalar damage parameter. The latter is considered an internal state variable and can be interpreted as a density of microcracks or microscopic voids in a material volume element. Material parameters governing the constitutive equations for creep strain rate and the damage evolution are identified based on experimental results of pristine and pre-damaged samples at a constant temperature. The plasticity parameters are estimated based on displacement-controlled cycling of pristine specimens. The numerical model is implemented in the structural mechanics finite element software ANSYS. With the implemented model a numerical simulation of a solder ball temperature cycling is performed and damage evolution is analyzed.

Fraunhofer Institute for Production Systems and Design Technology (DE), Technische Universität Berlin (DE), Politecnico di Milano (IT)
Openalex Percentile: Top 28%
Electronic Packaging and Soldering Technologies
0.73
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