Direct 3D Numerical Simulation Analysis of Buckled Dielectric Thin Film Packaging Based on Surface Wrinkling between Thin Film Cap and Polymer Ring

This paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The Si3N4 thin film has been buckled after temporary Si carrier wafer has been separated. It is found that mode change of the thinfilm cap has been occurred by measuring the thin-film cap shape at different times after Si substrate debonding. The conventional linear and nonlinear buckling simulations are not adequate to understand the behavior of the thin-film buckling mechanism creating such packaging cap mode change. Direct buckling simulation is recently reported as an easy and useful numerical wrinkling simulation method. A novel 3D FEM model of a thinfilm package suitable for direct 3D buckling simulation is built to reduce the mode mixture between different buckling modes. Buckling modes of the packaging cap are investigated in terms of elastic moduli of package materials and applied strain due to thermal expansion coefficient difference. The simulation results have revealed that there are two main modes in the fabricated thin-film buckling package determining the shape of the transferred thin-film packaging cover depending on the elasticity ratio between the cap and sealing ring materials. In addition, the mode shift from wrinkling cap mode to out-of-plane cap mode due to applied strain along the polymer sealing ring has been confirmed.