Enhancing Wire Simulation Accuracy Through X-ray Imaging and Deformation Analysis

The reliability of wire bonds in LED devices under temperature cycling tests is significantly affected by thermal expansion mismatches between encapsulation and wire materials, leading to mechanical stress and potential fatigue failure. Finite Element (FE) simulation is a powerful tool for designing reliable wire bonds. To improve simulation accuracy, this study integrates X-ray imaging, which provides precise wire geometry for constructing realistic models and serves as a validation tool for assessing simulation predictability. Cyclic thermomechanical simulations successfully predict plastic strain accumulation in the nailhead of wire bonds and capture differences between various wire bond designs. The simulation results align well with experimental observations, highlighting the influence of wire geometry on lifetime performance. The findings demonstrate that optimized wire bond designs enhance reliability, and the integration of X-ray imaging with FE simulations provides a robust framework for wire bond assessment and optimization.