Fatigue Delamination Study of Parylene as Electronic Packaging Material

Parylene has emerged as a promising substrate material in the development of electronic packaging due to its important dielectric properties, optical transparency, biocompatibility, and mechanical flexibility. However, limited information exists regarding its performance and properties bonded to other packaging materials under cyclic loading, which is critical for long-term reliability. This study presents the development of a numerical-experimental method for characterizing the delamination behavior of parylene under fatigue conditions, essential for the design and simulation of electronic packaging. A fatigue cohesive zone model (FCZM) was formulated to describe the strength degradation of a Si-Parylene C interface and integrated to a finite element model of the sample structure. The parameters of the FCZM were calculated trough its fitting to experimental data from a custom setup.