Evaluation of ESF3 Split-Gate Cell Cycling Endurance for Eeprom Applications

An extended Program/Erase cycling endurance study was performed on SuperFlash ESF3 split-gate cells to evaluate the feasibility of its usage in byte-erasable EEPROM architecture. It was shown that by using optimized program and erase conditions with ramped pulses it is possible to significantly reduce the degradation of erase speed compared to a single-pulse cycling, and to obtain cell endurance exceeding one million cycles. Use of error correction can further increase the array endurance capability with about 7 million cycle endurance predicted at 6 sigma level for optimized program/erase conditions.

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Published
2024-10-06
DOI
https://doi.org/10.1109/iirw62856.2024.11008736
Citations
1
Primary Topic
Advancements in Semiconductor Devices and Circuit Design
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article
Field-Weighted Citation Impact
0.21
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Evaluation of ESF3 Split-Gate Cell Cycling Endurance for Eeprom Applications

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1 citations
Advancements in Semiconductor Devices and Circuit Design
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article

Evaluation of ESF3 Split-Gate Cell Cycling Endurance for Eeprom Applications

H.A. Om'mani, Yuri Tkachev, P. Ghazavi, Steven Lemke, Louisa Schneider, Nhan Do
article en
1 citations

Abstract

An extended Program/Erase cycling endurance study was performed on SuperFlash ESF3 split-gate cells to evaluate the feasibility of its usage in byte-erasable EEPROM architecture. It was shown that by using optimized program and erase conditions with ramped pulses it is possible to significantly reduce the degradation of erase speed compared to a single-pulse cycling, and to obtain cell endurance exceeding one million cycles. Use of error correction can further increase the array endurance capability with about 7 million cycle endurance predicted at 6 sigma level for optimized program/erase conditions.

Microchip Technology (United States) (US)
Openalex Percentile: Top 43%
Advancements in Semiconductor Devices and Circuit Design
0.21
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