Breakthrough path of high-end equipment manufacturing driven by independent innovation

Focusing on R&D and industrialization of wafer stage of high-end lithography machine, this study deeply analyzes the development status and core challenges of China’s high-end equipment manufacturing industry. The study finds that although China’s high-end equipment manufacturing industry has achieved scale expansion and technological innovation, there are still deficiencies in the independent control of core technologies, facing the dual bottlenecks of technological innovation and basic capabilities. By analyzing the independent innovation practices of wafer stage, including aspects such as core technology breakthroughs, basic capacity enhancements, industrial chain collaboration, and the construction of industry-university-research support systems, the internal laws for the high-end equipment manufacturing industry to break through technological blockades are summarized. Furthermore, a general method for high-end equipment research and development is proposed, covering the dual-drive path of independent innovation, the collaborative innovation ecosystem of the industrial chain, the construction of an institutional guarantee system, and the collaborative evolution law of the innovation system. The research reveals the three core laws of technological leapfrogging, capacity building, and institutional adaptation, providing a “Chinese paradigm” for late-developing countries to achieve technological catch-up, which has important reference value for ensuring national industrial security and promoting the construction of a manufacturing powerhouse.