Kinetic analysis of workpiece rotation behavior during double-sided polishing

Unique clamping mechanism adopted in double-sided polishing (DSP) enables free rotation of workpieces, which is critical for achieving uniform material removal. However, the DSP process has long faced the issue of non-rotating workpieces, resulting in tapered shapes—an issue particularly relevant to silicon wafer polishing. In this study, a kinetic analysis is conducted to investigate workpiece rotation during DSP and to clarify the mechanism underlying tapering. This analysis identifies key variables governing rotational speed and primary factors contributing to workpiece nonrotation. These findings are validated experimentally, and a practical approach to preventing tapering is proposed.