Electrical Properties of Sealing Compositions with Increased Thermal Conductivity Based on Epoxy Resin Modified with Tetraethoxysilane

The work presents the results of studying the electrical characteristics of a sealing composition based on a tetraethoxysilane-modified epoxy resin filled with boron nitride. The dependence of the electrical resistance, as well as the permittivity and dielectric losses of the material in the microwave range on the content of tetraethoxysilane and boron nitride in concentrations that allow maintaining acceptable rheological characteristics for use as a potting compound is established.