Dopant chemical anchoring enables ultra-low interfacial thermal resistance composite phase-change metal foil with high reliability for efficient heat dissipation
In this study, by establishing covalent bonding between Field's metal and copper particles, a non-gallium alloy-based composite phase-change thermal interface material with high reliability and ultra-low interfacial thermal resistance was developed.
Authors
- Xiaoming Fang (ORCID: https://orcid.org/0000-0003-4039-1643)
- Yuliang Zhao (ORCID: https://orcid.org/0000-0002-6036-0601)
- Zhengguo Zhang (ORCID: https://orcid.org/0000-0002-3727-6778)
- Weihua Liu (ORCID: https://orcid.org/0000-0002-1967-6583)
- Ling Ziye
Institutions
- South China Institute of Collaborative Innovation (CN)
- South China University of Technology (CN)
Publication Details
- Journal
- Journal of Materials Chemistry A
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1039/d5ta01300c
- Primary Topic
- Thermal properties of materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Key Research and Development Program of China