Effect of humidity on the electrochemical migration

With the miniaturization of electronic devices, the impact of electrochemical migration (ECM) on the reliability of device packaging has become increasingly prominent. In this study, simulation models for ECM in interdigitated electrodes were developed through finite element method-based COMSOL Multiphysics, incorporating the electrochemical related properties of electrolytic cell, including electrodes, electrolyte, applied electric field, and so on. Through simulation experiments, the effects of humidity on ECM were systematically analyzed. The results show that higher humidity can significantly exacerbate electrochemical migration, as indicated by the exponentially increased diffusion flux and ion concentration. Our research results deeply analyze the change trend of ECM under different humidity conditions, and have important guiding significance for the next generation of miniaturized electronic devices to cope with atmospheric corrosion prevention.