Micro-CT analysis of creased and folded multilayer cardboard

Abstract Micro-CT analysis of experimentally creased and folded multilayer cardboards reveals insights into how the material deformation due to the creasing and folding process of cardboard impact the material concerning delaminations and position of broke particles. Delaminations were found in various locations and varied in size from just under a tenth of a millimeter to up to four times the thickness of the cardboard. The particles varied in size, ranging from a few micrometers to slightly larger than the cardboard thickness. Characteristic dimensions for the creased and folded cardboard were measured for selected cross sections. The differences in characteristic dimensions for the cross sections among the samples were typically a few hundredths of a millimeter. There are differences between cross-sections that are a few hundredths of a millimeter apart.