Intermetallic Compound Formation and Growth Behavior Between Ruthenium and Tin System

This study investigates the liquid/solid reflow process under a vacuum environment of 1 Pa at reflow temperatures of 300°C for different reaction times. The research finds that at the Sn/Ru interface, during 300°C reflow for 24 hours, the RU<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf>Sn<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">7</inf> intermetallic compound was formed. As the reflow time increases, the IMC thickness increases. This study provides a fundamental understanding of the interfacial reactions between Sn and Ru. The mechanisms of the interfacial reactions and the growth kinetics of the intermetallic compounds (IMC) will be revealed through phase diagrams, thermodynamics, and kinetic analysis.