Advanced Packaging Solutions by Intergrating 2.5D/3D Chiplet, Wafer Panel Level Package

This paper introduces an approach to panel level package (PLP) molding to meet the demand for an effective large-format packaging technology. For PLP molding, compression molding is an effective molding method that forms a package by compressing thermosetting resin inside a preheated mold chase. Using our unique method, this can be performed with minimal undesired resin flow. Furthermore, through uniform resin dispensing and the capability to separately handle the panel and the resin, our process also enables optimal molding conditions for the used materials. High-quality molding can thus be achieved contributing to improved device performance and reduced production costs.