Predicted Cu Plating Thickness Distribution in Fan-Out Panel Level Package with Global/Local Model

This study proposed the application of the finite element method (FEM) to predict the distribution of copper (Cu) electroplating thickness at the panel level. Initially, the electrochemical parameters of the electroplating solution were measured using a potentiostat and subsequently integrated into the simulation. A global/local modeling approach was employed to analyze the distribution of electroplating thickness in specific regions of interest. Furthermore, a three-step methodology was introduced to develop an optimized model, facilitating an effective transition from the global model to the local model. The results demonstrated a strong correlation between the model predictions and experimental measurements regarding the distribution of electroplating thickness.