Cost-Performance Silver- Aluminum Composite Sinter Paste with Improved Joint Reliability in SiC Power Device Applications
This study is to create a new die-attach bonding materials that are capable of meeting the rigorous demands of next-generation SiC power semiconductors. A composite sintering paste composed of silver-aluminum (Ag-Al) particles was proposed for bonding SiC to the DBC substrate, leveraging the low elastic modulus and high plastic deformability of Al particles. The joint structure was evaluated during a high temperature aging test at 300°C and a power cycling test with the junction temperature of 200°C. Compared to the silver sintered structure, the Ag-Al sintered joint exhibits superior structural stability during high-temperature aging and better long-term reliability during power cycling.
Authors
- Hiroaki Miyake (ORCID: https://orcid.org/0000-0003-4978-1023)
- Fupeng Huo (ORCID: https://orcid.org/0000-0002-0688-3540)
- Katsuaki Suganuma (ORCID: https://orcid.org/0000-0003-2137-9905)
- Chuantong Chen
- Kazutaka Takeshita
Institutions
- Tokyo City University (JP)
- Yamato University (JP)
- Osaka Research Institute of Industrial Science and Technology (JP)
- The University of Osaka (JP)
Publication Details
- Published
- 2025-04-15
- DOI
- https://doi.org/10.23919/icep-iaac64884.2025.11002880
- Primary Topic
- Aluminum Alloys Composites Properties
- Type
- article
- Field-Weighted Citation Impact
- 0.00