Development Fine Pitch Organic Hybrid Bonding Application

Low-temperature polymer hybrid bonding with excellent process compatibility and cost advantages, utilizing Fly-cutting instead of Chemical Mechanical Polishing (CMP), have been developed for 3D stacked hybrid bonding technology. Successful demonstrations of polymer-to-polymer and solder-to-solder hybrid bonding under low-temperature bonding have been achieved. This study addressed key process issues and ultimately demonstrated the effectiveness of the fly-cutting with descum process for solder protrusions on test vehicles, resulting in polymer-to-polymer and solder-to-solder hybrid bonding. Furthermore, the pitch was reduced to 5µm, and successful organic hybrid bonding results between polymers and oxides, as well as solder and Cu, were achieved.