Comparison of Thermomigration Velocity Between Sn-Cu<sub>0.7</sub> and Ternary Sn-Bi-In Solder
Thermomigration behaviors of Cu atoms in both ternary Sn-Bi-In solder and commercial Sn-Cuo.7 solder are investigated respectively at the reflow state to reveal the effect of sluggish diffusion in multi-principal element solder joint. Under the same homologous temperature, ternary Sn-Bi-In solder does not show an obvious thermo migration phenomenon, while the Sn-Cuo.7 solder shows evident thermo migration, which is exhibited as the difference in the inter metallic compound thickness at hot and cold ends. Under the same absolute temperature (250°C) with a temperature gradient of 300 °C/cm, thermo migration behaviors can be observed in both ternary Sn-Bi-In and Sn-Cuo.7 solder. The thermo migration effect of the Sn-Cu<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.7</inf> solder is almost 4 times stronger than that of the Sn-Bi-In solder.
Authors
- Yonghua Duan (ORCID: https://orcid.org/0000-0001-8408-2709)
- Yingxia Liu (ORCID: https://orcid.org/0000-0003-0482-3904)
- Xingchao Mao (ORCID: https://orcid.org/0000-0003-1560-9591)
- K. N. Tu (ORCID: https://orcid.org/0000-0002-7781-2707)
- Qinglei Sun (ORCID: https://orcid.org/0000-0002-3860-9749)
- Yifan Yao (ORCID: https://orcid.org/0000-0001-7510-7492)
Institutions
- City University of Hong Kong (HK)
Publication Details
- Published
- 2025-04-15
- DOI
- https://doi.org/10.23919/icep-iaac64884.2025.11002945
- Citations
- 1
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.73