Application of Indium Sheet Thermal Interface Material in Advanced Semiconductor Packaging
In this study, an indium sheet was applied to a flip-chip ball grid array product and subjected to a ball mount reflow process (maximum temperature: 245°C) to observe sintering of the indium sheet. Regarding void formation caused by residual flux, different flux amounts were applied to determine whether reducing the flux quantity mitigates void formation.
Authors
- Tuo‐Hung Hou (ORCID: https://orcid.org/0000-0002-9686-7076)
- Wen-Yu Teng
- Debby Li
- Leon Li
- Liang Yih Hung
- Yu-Po Wang
- Lewis Huang
- Don Son Jiang
- Andrew H. Kang
Institutions
- Siliconware Precision Industries (Taiwan) (TW)
Publication Details
- Published
- 2025-04-15
- DOI
- https://doi.org/10.23919/icep-iaac64884.2025.11002901
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00