Optimization of Au-Ag-Pd Alloy Wire Bonding for Stacked NAND Flashes

Gold-silver (Au-Ag) alloy wire is a better low-cost solution for packaging interconnection of the stacked NAND flashes. Optimization analyses by using a full factorial design of experiment (DOE), analysis of variance (ANOVA), and response surface methodology (RSM) are applied to obtain the optimization of Au-Ag-Pd alloy wire bonding parameters and sequences for stacked NAND flashes. The conventional Au-4N and Pd-doped Au-2N wires are also studied for the comparison.