The Effect of Key Factors on 3D X-Ray Imaging for Fan-Out Package

In this paper, 3D X-ray inspection is applied to the failure analysis of Fan-out advanced packaging. The Taguchi method was used to simplify the experimental condition combinations. Meanwhile, use Laplacian variance to identify and quantify the image clarity of copper fine lines in Fan-out packages.

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Published
2025-04-15
DOI
https://doi.org/10.23919/icep-iaac64884.2025.11003029
Primary Topic
Cultural and Historical Studies
Type
article
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article

The Effect of Key Factors on 3D X-Ray Imaging for Fan-Out Package

Cheng-Hsin Liu, Fan-Ju Hsiao, Yi‐Sheng Lin
Cultural and Historical Studies
article

The Effect of Key Factors on 3D X-Ray Imaging for Fan-Out Package

Cheng-Hsin Liu, Fan-Ju Hsiao, Yi‐Sheng Lin
article en

Abstract

In this paper, 3D X-ray inspection is applied to the failure analysis of Fan-out advanced packaging. The Taguchi method was used to simplify the experimental condition combinations. Meanwhile, use Laplacian variance to identify and quantify the image clarity of copper fine lines in Fan-out packages.

Advanced Semiconductor Engineering (Taiwan) (TW)
Openalex Percentile: Top 90%
Cultural and Historical Studies
DOISourceOpenAlex
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The Effect of Key Factors on 3D X-Ray Imaging for Fan-Out Package — Cheng-Hsin Liu, Fan-Ju Hsiao, et al. · (2025) | TGRS Research Map | TGRS