Nanoindentation Study of Phases in Near-Eutectic Sn-Bi Alloy

The low melting point of Sn-Bi alloys makes them promising materials for low temperature solders (L TS). However, Sn-Bi alloys are brittle under high strain-rates, presenting a major hurdle for widespread commercialisation. To formulate solutions to this problem, it is important to understand the contribution of the individual phases in the Sn-Bi alloys to their overall mechanical properties. In this work, the hardness of each phase in a near-eutectic Sn-S7wt%Bi alloy is studied using nanoindentation. Results show that the hardness of the Sn phases in the alloy is higher than that of pure Sn due to solid solution strengthening, while the primary Sn phase is harder than the eutectic Sn phase due to precipitation hardening from Bi. In contrast, the hardness of the Bi phase in the alloy is similar to that of pure Bi, as these strengthening mechanisms are minimal due to the low solubility of Sn in Bi.

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Published
2025-04-15
DOI
https://doi.org/10.23919/icep-iaac64884.2025.11002920
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
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Nanoindentation Study of Phases in Near-Eutectic Sn-Bi Alloy

Kazuhiro Nogita, Takahito Ohmura, V. Thomas Paul, Xin Fu Tan et al.
Electronic Packaging and Soldering Technologies
article

Nanoindentation Study of Phases in Near-Eutectic Sn-Bi Alloy

Kazuhiro Nogita, Takahito Ohmura, V. Thomas Paul, Xin Fu Tan, Stuart D. McDonald
article en

Abstract

The low melting point of Sn-Bi alloys makes them promising materials for low temperature solders (L TS). However, Sn-Bi alloys are brittle under high strain-rates, presenting a major hurdle for widespread commercialisation. To formulate solutions to this problem, it is important to understand the contribution of the individual phases in the Sn-Bi alloys to their overall mechanical properties. In this work, the hardness of each phase in a near-eutectic Sn-S7wt%Bi alloy is studied using nanoindentation. Results show that the hardness of the Sn phases in the alloy is higher than that of pure Sn due to solid solution strengthening, while the primary Sn phase is harder than the eutectic Sn phase due to precipitation hardening from Bi. In contrast, the hardness of the Bi phase in the alloy is similar to that of pure Bi, as these strengthening mechanisms are minimal due to the low solubility of Sn in Bi.

The University of Queensland (AU), National Institute for Materials Science (JP)
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Electronic Packaging and Soldering Technologies
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