PFAS-Free Assembly Material Development

Environmental pollution from Per- and polyfluoroalkyl substances (PFAS) poses significant ecological challenges because of their persistence and toxicity. PFAS is widely contained in numerous industries, such as semiconductors, food packaging and firefighting foam. In the semiconductor industry, die attach adhesives can be used in the assembly packages of Thin and Fine Ball Grid Array (TFBGA). PFAS is contained in die attach adhesives as additives. In this study, by total fluorine analysis, we verified an effective PFAS substitution of the die attach adhesive formulation. Meanwhile, the PFAS-free adhesive was confirmed to have same level of performance with the PFAS-containing adhesive by comparing their workability, DSC, and TGA. This paper provides a viable PFAS-free solution for TFBGA packages.