Optimized Flux-Less Bonding Process for High Throughput Using Simplified Equipment

We demonstrated flux-less TCB with a simplified process. This process involves a pre-treatment with a safe weak acid to remove metal oxides and the addition of basic functionalities to the bonder equipment. As a result, it enables a simplified equipment configuration compared to conventional flux-less TCB methods that involve hazardous materials. Furthermore, we optimized the newly adopted techniques for flux-less bonding for high throughput.