Study on the Global-Local Method with Critical Mesh Size Control for $3\mathrm{D}$ Wafer-Level Packaging Simulation Time Reduction

This study focuses on applying the global-local finite element method (FEM) to the structure of Wafer-Level Packaging (WLP). Under accelerated thermal cycling loading conditions, the use of the Multi-Point Constraint (MPC) method significantly reduces the number of model elements, effectively saving simulation time while achieving prediction results with minimal deviation compared to experimental data. Additionally, through mesh compensation, the predictive results of all test vehicle models can be further aligned with experimental results, enabling the identification of the optimal key mesh size for the MPC model designed in this study.