Influence of Geometrical Design based on Copper Direct Bonding Process

In 3DIC manufacturing, the design of the copper pad shape and temperature process in the hybrid bonding process is important. As a result of analyzing the copper-to-copper thermal behavior in the hybrid bonding process using FEA and DOE methods, it was found that the relationship between copper volume and temperature is closely related to bonding quality. Due to the difference in thermal deformation of copper at the bonding interface, bonding failures tend to occur at the edge of the copper bonding pad, which greatly affects the thermal reliability of the product.