Digital-Twin Technology Solutions for Chip-Package-PCB-Antenna Systems

A new Digital-Twin technology platform is introduced for enabling system-level Chip-Package-PCB-Antenna co-design, co-simulation and co-verification. The platform, based on noise and correlation-aware progressive workflow of physicsinformed behavioral modeling, integrating VISION software developed by Dassault Systèmes, hosts an innovative SPICE compatible broadband RLC representation of antenna elements. The ability of the platform to account for dynamic impedance loading of antennas by multi-harmonic (MH) nonlinear RF electronics is demonstrated using hybrid 3D heterogeneous technologies. The proposed approach is validated through several practical applications using front-end-modules (FEMs) codesigned in advanced GaN and FDSOI technologies co-assembled with antenna-in-package (AiP) modules in various packages including Wafer-Level-Chip-Scale-Packaging (WLCSP) fanin/fan-out, system-in-package (SiP) and multi-chip-modules (MCM). The resulting benefits of coherent measurement (OTA instrumentation) and modeling (EDA tooling) solutions go beyond productivity enhancement, they open new possibilities for transforming apparent antagonisms between theory and experiment into necessary complementarities driving Digital-Twin requirements. The Digital-Twin technology will enable new generations of tooling (unified EDA & OTA) where classical Electromagnetic (EM) metrics (radiation pattern, noise, auto and cross-correlation functions, power-spectral-density) are extended with wireless-circuit metrics (e.g., EVM, SNR ACPR, NMSE).