Acceleration of Silver Micro-Flake Sintering to Enhance Interconnection Integrity Using a Flexible Epoxy-Based Binder

To develop a bonding material with a high thermal conductivity that could be used for large-area adhesive structures, research has been conducted on resin-bonded conductive adhesives that sinter silver micro-particles in the binder. In this research, we conducted fundamental research to apply a flexible epoxy resin to the conductive adhesive binders to further enhance the stress-relieving effect of the adhesive due to the inclusion of a resin. As a result, by applying the resin, the electrical resistivity of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$10^{-6}\Omega\cdot \text{cm}$</tex>, which had previously been obtained by curing at 250°C or higher, was obtained even with curing at 190 °C. In addition, the flexible epoxy resin samples showed more progress in sintering the silver micro-flakes, suggesting that the application of this resin contributes to the promotion of sintering. This research has shown that it is possible to create a resin-bonded conductive adhesive that promotes the sintering of silver microparticles, is flexible, has high conductivity, and has good adhesion to metal electrodes.