Advanced Package Solution Applied on High Performance Computing for Heterogeneous Integration

The research and discussion in this paper, there are package design with the structure of FOCoS (Fan Out Chip on Substrate) for an actual high-performance computing IC device with one ASIC (Application Specific Integrated Circuit) chip and two HBM3e (High Bandwidth Memory) chips. In the process of this study, the interface of HBM3e memory is applied on data transfer between ASIC chip to high bandwidth memory. Through stress and electrical analysis, the suitable RDL (Re-Distribution Layer) structure and routing topology are used to ensure process yield.