An Additively Manufactured 300 GHz Dielectric Rod Antenna Packaging for Sub-THz Radar Camera Applications

This paper presents a novel, 3D-printed dielectric packaging approach for application as sub-THz antenna-inpackage (AiP) solution. The application of the dielectric AiP to an on-chip antenna results in a considerable enhancement in gain and efficiency when compared to non-packaged antennas. In comparison to more complex LTCC- or glass-based packaging solutions, the proposed dielectric AiP requires only a single material that can be produced at a low cost and with minimal effort through the use of 3D-printing. Due to the homogeneity of the package, system complexity is significantly reduced. The AiP approach is benchmarked against conventional dielectric rod antennas, which were also fabricated and characterized as part of this work. This is essential for sub-THz radar camera systems, whose low gain on-chip antennas are usually insufficient. The package approach also provides increased chip protection, as well as cost-effective manufacturing and greatly simplified assembly.