Fabrication and Characterization of 3D Printed mmWave RF Devices

Employing a novel 3D printing technique, a ring resonator and a patch antenna array for millimeter-wave applications were successfully fabricated. Microscopic examination confirmed precise dimensional accuracy and manufacturing tolerances. Frequency domain measurements validated the design, with the antenna array achieving a -10 dB bandwidth of 1.6 GHz and a resonant frequency of 34.6 GHz. The ring resonator's first four modes accurately determined the dielectric's relative permittivity for 10–37 GHz, demonstrating the feasibility of this technology to produce high-precision RF components at millimeter-wave frequencies.

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Publication Details

Published
2025-03-30
DOI
https://doi.org/10.23919/eucap63536.2025.10999393
Primary Topic
3D IC and TSV technologies
Type
article
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Fabrication and Characterization of 3D Printed mmWave RF Devices

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Fabrication and Characterization of 3D Printed mmWave RF Devices

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article en

Abstract

Employing a novel 3D printing technique, a ring resonator and a patch antenna array for millimeter-wave applications were successfully fabricated. Microscopic examination confirmed precise dimensional accuracy and manufacturing tolerances. Frequency domain measurements validated the design, with the antenna array achieving a -10 dB bandwidth of 1.6 GHz and a resonant frequency of 34.6 GHz. The ring resonator's first four modes accurately determined the dielectric's relative permittivity for 10–37 GHz, demonstrating the feasibility of this technology to produce high-precision RF components at millimeter-wave frequencies.

Netherlands Organisation for Applied Scientific Research (NL), Holst Centre (Netherlands) (NL), Eindhoven University of Technology (NL)
Openalex Percentile: Top 91%
3D IC and TSV technologies
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