A Novel UV Curable Wafer Back Side Protection Film

Mobile communications packages are expected to become increasingly functional, thinner, and lighter. One of these package designs, WLCSP (Wafer Level Chip Size Package). However, these evolutions involve the problem of fragility of electronic devices. We have developed and provided Back side Protection-Film (BPF). In this study, the UV curable BPF showed excellent resistance of the flux cleaning solvent and high die shear strength required for the Flip chip bonding process. UV curable BPF can provide new processes which can produce semiconductor packages with less thermal energy and increases productivity compared to the thermosetting type.