Moisture Diffusion Analysis of FOCoS Package During Assembly Processes
In this paper, we will investigate the impact of control time at several critical stages of the manufacturing process on the extent of moisture diffusion for a Fan-Out Chip on Substrate (FOCoS) package. In addition to studying the extent of moisture diffusion, we will also examine the magnitude of stress caused by the moisture absorption process and evaluate which areas in the FOCoS structure require special attention to prevent moisture degradation.
Authors
- Fan-Yu Min
- Chih-Ping Hung
- Chang‐Chun Lee (ORCID: https://orcid.org/0000-0002-4278-6510)
- Wang Tai (ORCID: https://orcid.org/0000-0001-6907-492X)
- Tang-Yuan Chen (ORCID: https://orcid.org/0000-0002-6567-7499)
- Chen-Chao Wang (ORCID: https://orcid.org/0000-0002-7690-6656)
- Dao-Long Chen (ORCID: https://orcid.org/0000-0001-7856-9457)
Institutions
- Advanced Semiconductor Engineering (Taiwan) (TW)
Publication Details
- Published
- 2025-04-15
- DOI
- https://doi.org/10.23919/icep-iaac64884.2025.11003042
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00