Cu/Diamond Composite Heat Spreader for Thermal Management of Advanced Electronic Devices

Cu/diamond composite with high thermal conductivity and low thermal expansion is developed. In this paper, the effect of manufacturing condition of the composite on thermal conductivity is discussed. The result of the reliability test; the heat shock test is also discussed. The method to measure the thermal conductivity for a larger size composite like <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$50\times 50$</tex> mm is explained.

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Published
2025-04-15
DOI
https://doi.org/10.23919/icep-iaac64884.2025.11002981
Primary Topic
Heat Transfer and Optimization
Type
article
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article

Cu/Diamond Composite Heat Spreader for Thermal Management of Advanced Electronic Devices

M. Sakai, Satoshi Teraji, Tasuku Hamano
Heat Transfer and Optimization
article

Cu/Diamond Composite Heat Spreader for Thermal Management of Advanced Electronic Devices

M. Sakai, Satoshi Teraji, Tasuku Hamano
article en

Abstract

Cu/diamond composite with high thermal conductivity and low thermal expansion is developed. In this paper, the effect of manufacturing condition of the composite on thermal conductivity is discussed. The result of the reliability test; the heat shock test is also discussed. The method to measure the thermal conductivity for a larger size composite like <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$50\times 50$</tex> mm is explained.

Ihara Chemical Industry (Japan) (JP)
Affordable and clean energy
Openalex Percentile: Top 89%
Heat Transfer and Optimization
DOISourceOpenAlex
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Cu/Diamond Composite Heat Spreader for Thermal Management of Advanced Electronic Devices — M. Sakai, Satoshi Teraji, et al. · (2025) | TGRS Research Map | TGRS