Research on System Circuit Electrothermal Analysis Based on Non-Contact Near-Field Measurement

In the post-Moore era, heat dissipation challenges in high-frequency, high-density integrated circuits have become increasingly significant due to the demands for miniaturization and high performance. This study aims to analyze the correlation between temperature and electromagnetic field distribution. Using serpentine traces and coupled band-pass filters as samples, we examine how thermal effects influence electromagnetic field patterns under varying environmental temperatures in Ansys Icepak. It is expected that non-contact near-field measurement can simultaneously identify high-temperature regions in system circuits while obtaining electromagnetic field distributions. Furthermore, this approach can be extended to study the impact of temperature variations on EMI distribution, laying the foundation for future non-contact measurement systems and enabling precise thermal and electromagnetic analysis for advanced packaging technologies and high-speed signal designs.