Simulation of CUF Fillet Height and Minimize Void on Reliability

This letter presents a novel approach for underfill prediction prior to real experiments or mass production. The effects of high-density bump pitch and low bump or copper pillar height significantly influence the underfill performance in future applications. The proposed methodology, supported by simulation results, highlights the importance of contact angle and the fluid formulation in optimizing multi-step dispensing processes. However, the impact of the dispense pattern closely aligns with real sample builds.